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| data sheet Features: LEADFRAME MQFP PowerQuad(R) 2 Exceptional thermal and electrical performance by design include the following: * Very high conductive, solid copper heatsink * 50% reduction in package self inductance * 64-304 lead counts (14 x 14 mm to 40 x 40 mm body size) * Industry-accepted JEDEC package outlines * Low stress mold compound * Heatsink-up and heatsink-down configurations available * ~50% improvement in Theta JA over standard MQFP MQFP PowerQuad(R) 2 Packages: The MQFP PowerQuad(R) 2 (PQ2) is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through the use of an innovative, integrated, embedded copper heatsink. The IC is attached directly to this large, highly efficient heatsink which readily extracts generated heat under demand situations. To enhance the thermal conduction from the IC to the mounting surface, the internal package leads are mechanically connected, yet electrically isolated, by a proprietary process to the heatsink. Thermal resistance improvements greater than 50% can be realized with this technology without the use of any external cooling aids! The large heatsink also provides a "floating" ground plane to the signal leads, reducing self inductance by 50% (over conventional plastic QFPs). Additionally, the patented PQ2 heatsink has integrated mechanical "locking" features to ensure package integrity while eliminating moisture penetration. The end result is a high-power, high-speed IC package with the properties to enable new electronic products and emerging end applications to move from concept to production. Thermal Resistance: Multi-Layer PCB Theta JA (C/W) by Velocity (LFPM) Pkg 100 ld 208 ld 240 ld 304 ld Electrical: 0 17.6 12.6 11.8 10.3 200 14.7 10.4 9.6 8.4 Self Inductance 500 13.3 9.2 8.4 7.2 Bulk Capacitance Self Resistance Body Pkg Size(mm) Lead (nH) (pF) (m) 100 ld 14 x 20 Longest Shortest 208 ld 28 x 28 Longest Shortest 240 ld 32 x 32 Longest Shortest 304 ld 40 x 40 Longest Shortest Simulated Results @ 100 MHz 4.550 2.560 8.740 5.310 7.710 4.900 12.200 7.280 1.230 0.768 1.970 1.590 1.580 1.180 2.650 2.040 60.1 26.9 100.0 73.5 87.8 57.3 144.0 93.5 Reliability: Reliability is of prime importance and long-term performance is assured by advanced designs, manufacturing process and materials. * * * * Temp cycle Autoclave Temp/humidity High temp storage -65/+150 C, 1000 cycles 121 C, 2 atm, 504 hours 85 C/85%RH, 1000 hours 150 C, 1000 hours Applications: Major semiconductor packaging engineers and manufacturers have chosen PowerQuad(R) 2 as the IC package of choice for advanced, power micr processors,DSPs, high-speed logic / FPGAs, PLDs, ASICs and other similar technologies. System designers and OEM product developers find PQ2 solves power / thermal / speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support). PQ2 is ideal for: PCs, notebooks, high-end audio/video, power supplies, VME CPU board systems, workstations, RISC engine modules, GUI boards and many other applications. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS185H Rev Date: 05'06 data sheet Cross-sections MQFP PowerQuad(R) 2 Mold Compound Gold Wire LEADFRAME MQFP PowerQuad(R) 2 Process Highlights Die thickness (max) 25 mils Strip solder plating 85/15 Sn/Pb Marking Pad Lead inspection Laser/optical Pack/ship options Bar code/dry pack/TNR Die Attach Adhesive Cu Leadframe Die Cu Heat Slug Polyimide Nickel Plated Black Oxide Black Oxide Test Services * Program generation/conversion * Product engineering * Wafer sort * Contact Amkor Test Services for more details Nickel Plated Polyimide Cu Leadframe Cu Heat Slug Die Shipping Low profile tray (JEDEC Outline CS-004) Die Attach Adhesive Mold Compound Gold Wire Inverted Configuration Options: MQFP POWERQUAD(R) 2 PACKAGE FAMILY (UNITS IN MM) Lead Count 64 120 128 144 160 208 256 240 304 Body Size 14 x 14 28 x 28 28 x 28 28 x 28 28 x 28 28 x 28 28 x 28 32 x 32 40 x 40 Body Thickness 2.0 3.37 3.37 3.37 3.37 3.37 3.37 3.40 3.80 Lead Pitch 0.80 0.80 0.80 0.65 0.65 0.50 0.40 0.50 0.50 Form Length 1.60/1.95 1.30/1.60 1.30/1.60 1.30/1.60 1.30/1.60 1.30/1.60 1.30/1.60 1.30 1.30 Tip To Tip 17.2 x 17.9 30.6/31.2 30.6/31.2 30.6/31.2 30.6/31.2 30.6/31.2 30.6/31.2 34.6 42.6 Foot Length 0.80 0.56/0.88 0.56/0.88 0.56/0.88 0.56/0.88 0.56/0.88 0.56/0.88 0.56 0.56 Board Standoff 0.15 0.13/0.33 0.13/0.33 0.13/0.33 0.13/0.33 0.13/0.33 0.13/0.33 0.38 0.43 JEDEC MS-022 MS-029/022 MS-029/022 MS-029/022 MS-029/022 MS-029/022 MS-029/022 MS-029 MS-029 Units Tray Matrix 6 x 14 3x8 3x8 3x8 3x8 3x8 3x8 3x8 2x6 Per Tray 84 24 24 24 24 24 24 24 12 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor's warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. |
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